Materials Analysis
SVTC provides materials analysis to help customers better understand the chemical and physical properties of their new product or technology. SVTC can characterize a wide variety of materials to aid in research, process/product development, materials selection, and process optimization.
Auger - Electron Spectroscopy (AES)
- Surface composition analysis
- Elemental mapping
- Film composition with depth
Secondary Ion Mass Spectrometry (SIMS)
- Low Energy SIMS Profile
- Ultra-shallow dopant profiling
- Ultra-thin-film characterization
- Backside depth profiling
- X-ray and electron energy loss spectra
- Scanning TEM HAADF (Z-contrast) imaging
- EELS and EDXS linescans
- Elemental identification
- Semi-quantitative standard-less compositional analysis
- Chemical profiling with sub-1 nm sampling region
- Energy Filtered Imaging
Vapor Phase Decomposition
Inductively Coupled Plasma Mass Spectrometry
(VPD-ICP-MS)
- Whole-wafer analysis with detection limits down to E07 atoms/cm2
- Correlation with TXRF measurements
- Trace metal contamination analysis on wafer surface
- Light element analysis
Total Reflection X-Ray Fluorescence (TXRF)
- High sensitivity quantitative analysis of elemental contamination on solid surfaces
- Non-destructive mapping of elemental distributions
X-ray Photoelectron Spectroscopy (XPS)
- Obtain chemical bonding information from species on solid surfaces
- Quantitative elemental analysis of surface contamination at the low % level