Failure Analysis
Techniques:
Circuit Edit
Defect Isolation
Package part , wafer or die level Analysis
Overview:
Wafer, Die & Packaged part level Electrical and Physical Analysis solutions.
SVTC provides leading edge solutions helping our clients to locate and characterize defects using state of the art techniques and experience.
Following introduction and technical objective discussions with our clients, SVTC’s Analytical Team will utilize methods from the following list to help determine the most technically and commercially feasible approach:
- 3D Tomography
- C-SAM
- X-Ray
- Fib Circuit edit
- Mechanical and Chemical Decap / Deprocess
- Microprobing
- Full physical inspection and Analysis tools