Focused Ion Beam (FIB)
Uses
Applications
Technical Specifications
Alternatives
Focused Ion Beam (FIB) is a technique used for site-specific analysis, deposition, and ablation of materials using a focused beam of (Ga+) ions. The focused beam of (Ga+) ions is rastered on the surface of the material to be analyzed. As the beam hits the surface, a small portion of material is sputtered and/or dislodged, from the surface of the material. The dislodged material can be in the form of atoms, secondary ions and/or secondary electrons which can then be collected and analyzed as signals to form an image.
- High resolution imaging of surfaces and structures
- Sputter removal of material to expose buried features and prepare cross-sectional views of solid materials
- Site-specific preparation of cross-sectional views for SEM imaging
- Site-specific preparation of thin lamella for TEM imaging
- Identification of failing contacts using voltage contrast
- Imaging of grains and grain boundaries in metals
- 45nm and back side edit capable configured with Camelot Navigation Software
- 30kV 5nm resolution Sidewinder Ion Column
- 5nm image resolution @ 30kV accelerating voltage
- 150mm x 150mm eucentric stage
- GIS Gas Chemistry and deliever system (Platinum, Tungsten, Carbon & SiO2)
- To obtain composition of particles or features: AES, SEM-EDS, STEM-EELS
- To prepare samples from sputter-sensitive materials: cleaving, polishing